Transistor Thermal Performance Testbench

This model shows how transistor power dissipation affects the heat generated from junction to case to heatsink.

Transistor Thermal Performance Model

Developed by Rodney Tan (PhD)

Version 1.1.0 (Oct 2024)

This model shows how the transistor power dissipation affects the heat generated from junction to case to heatsink. The transistor is based on MOSFET IRF540 datasheet RJC (Junction to Case) and RCS (Case to Sink) thermal resistance. It allows user to set RSA (Sink to Ambient) thermal resistance which represent the external heatsink to analyze the transistor thermal performance.

The Junction and case thermal time constant is set to [0.1,1] second for the purpose of speeding up the simulation time.